公开(公告)号：US20240063344A1

公开(公告)日：2024-02-22

申请号：US17889922

申请日：2022-08-17

申请人： CreeLED, Inc.

发明人： Steven Wuester ,  Seth Joseph Balkey ,  Colin Stuart ,  Peter Andrews

IPC分类号： H01L33/42 ,  H01L33/44 ,  H01L33/00

CPC分类号： H01L33/42 ,  H01L33/44 ,  H01L33/005

摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and a semi-transparent metallic layer deposited on an LED chip that can dim a light output of the LED chip are disclosed. The thickness of the semi-transparent metal layer can be adjusted based on the desired dimming level. In an embodiment, the metallic layer can be deposited on top of a passivation layer over the LED structure, so that the metallic layer is not electrically coupled to the LED. The metallic layer can additionally cover the mesa sidewalls of the LED structure. The metallic layer can be titanium, or platinum, or other suitable metals in other embodiments. In an embodiment, the metallic layer can be deposited on to the passivation layer, where a length of time the metallic layer is deposited, can be based on the amount of dimming desired.