公开(公告)号：US20240032237A1

公开(公告)日：2024-01-25

申请号：US18124810

申请日：2023-03-22

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20409 ,  H05K7/20436

Abstract: An apparatus cools electronic circuitry. A housing encloses the electronic circuitry and includes a plurality of surfaces, each configured to face an adjacent inner wall of the back box upon the housing being mounted inside the back box. A rear surface faces a rear wall of the inner walls of the back box. A mounting plate is disposed opposite to the rear surface, is in thermal contact with the housing, and faces away from the back box. A touch plate is atop of, and in thermal contact with, the mounting plate. The mounting plate and the touch plate combine to provide a path for conducting heat generated by the electronic circuitry away from the housing and for radiating the heat to ambient air. The mounting plate or the touch plate is made of a higher thermal conductivity material to facilitate conduction of heat away from the housing.

公开(公告)号：US12178004B2

公开(公告)日：2024-12-24

申请号：US18638846

申请日：2024-04-18

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：US20240032235A1

公开(公告)日：2024-01-25

申请号：US17868941

申请日：2022-07-20

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20209 ,  H05K7/20409

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：US12250788B2

公开(公告)日：2025-03-11

申请号：US18124810

申请日：2023-03-22

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. A housing encloses the electronic circuitry and includes a plurality of surfaces, each configured to face an adjacent inner wall of the back box upon the housing being mounted inside the back box. A rear surface faces a rear wall of the inner walls of the back box. A mounting plate is disposed opposite to the rear surface, is in thermal contact with the housing, and faces away from the back box. A touch plate is atop of, and in thermal contact with, the mounting plate. The mounting plate and the touch plate combine to provide a path for conducting heat generated by the electronic circuitry away from the housing and for radiating the heat to ambient air. The mounting plate or the touch plate is made of a higher thermal conductivity material to facilitate conduction of heat away from the housing.

公开(公告)号：US20230278826A1

公开(公告)日：2023-09-07

申请号：US18116905

申请日：2023-03-03

Applicant: Crestron Electronics, Inc.

Inventor： Kriss Replogle ,  Charles Magrino ,  Brian Clough ,  David Paolazzi ,  Obioma Chukwuocha

IPC: B65H75/36 ,  B65H51/08

CPC classification number: B65H75/362 ,  B65H51/08 ,  B65H75/368 ,  B65H2511/51 ,  B65H2511/515 ,  B65H2513/40

Abstract: A cable retractor includes a housing. A motorized drive section within the housing urges at least a segment of cable past the drive section. A chamber within the housing holds at least another segment of the cable that is stored freely without a specific arrangement of the cable. The motorized drive section urges the cable in a first direction to draw the at least another segment from the chamber, then past the motorized drive section, and then through an external opening in the housing to outside. The motorized drive urges the cable in a second, opposing direction to draw the another segment through the external opening in the housing from outside, then past the motorized drive section, and then into the chamber, the another segment being urged freely into the chamber without a specific arrangement of the cable in the chamber.

公开(公告)号：US20240268064A1

公开(公告)日：2024-08-08

申请号：US18638846

申请日：2024-04-18

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20209 ,  H05K7/20409

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：US12016153B2

公开(公告)日：2024-06-18

申请号：US17868941

申请日：2022-07-20

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20209 ,  H05K7/20409

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.