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    Small form factor liquid loop cooling system
    1.
    发明授权
    Small form factor liquid loop cooling system 有权
    小尺寸液环冷却系统

    公开(公告)号：US07203063B2

    公开(公告)日：2007-04-10

    申请号：US10849759

    申请日：2004-05-21

    申请人： Cullen E. Bash ,  Glenn C. Simon ,  Christopher G. Malone ,  Ratnesh K. Sharma

    发明人： Cullen E. Bash ,  Glenn C. Simon ,  Christopher G. Malone ,  Ratnesh K. Sharma

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20009 ,  H05K7/20727 ,  H05K7/20772

    摘要： An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.

    摘要翻译： 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统，其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 冷板与至少一个计算机部件热连通，并且使用液体冷却剂对流地从该部件移除热量。 热交换器从液体冷却剂中散热，并向冷板提供液体冷却剂。 底盘内的空气推动器冷却热交换器，将空气吹过需要冷却的其他部件，并从机箱中除去加热的空气。 空气推动器可以基本上延伸穿过底盘，或者可以从出口通风方向横向吹动。

    Small form factor cooling system
    2.
    发明授权
    Small form factor cooling system 有权
    小型冷却系统

    公开(公告)号：US07068509B2

    公开(公告)日：2006-06-27

    申请号：US10772115

    申请日：2004-02-03

    申请人： Cullen E. Bash ,  Glenn C. Simon ,  Christopher G. Malone

    发明人： Cullen E. Bash ,  Glenn C. Simon ,  Christopher G. Malone

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20727 ,  H05K7/20772

    摘要： An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

    摘要翻译： 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统，其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 蒸发器与至少一个计算机部件热连通，并蒸发冷却剂以冷却该部件。 冷凝器从冷却剂蒸汽散发热量，并将液体冷却剂提供回蒸发器。 冷凝器将液体冷却液重力向下引导，使冷凝器和蒸发器重力驱动。 底盘内的空气推进器冷却冷凝器，将空气吹向需要冷却的其他部件，并从机箱中除去加热的空气。

    Thermal connection layer
    3.
    发明授权
    Thermal connection layer 有权
    热连接层

    公开(公告)号：US06853554B2

    公开(公告)日：2005-02-08

    申请号：US10022112

    申请日：2001-12-14

    申请人： Cullen E. Bash ,  Chandrakant D. Patel ,  Glenn C. Simon

    发明人： Cullen E. Bash ,  Chandrakant D. Patel ,  Glenn C. Simon

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20772

    摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

    摘要翻译： 一种模块化半导体芯片冷却系统，其具有容易打开的外壳，其限定了配置成容纳承载待冷却部件的印刷电路板的室。 外壳可以包括储存器，冷凝器和泵。 室内的喷雾器可调节地安装在一个或多个支架上，以允许每个喷雾器为其各自部件的单独高度设定。 外壳可以通过快速释放连接容易地从计算机系统中移除。 计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统，从各个模块中去除冷凝功能。

    Thermal connector for cooling electronics
    4.
    发明授权
    Thermal connector for cooling electronics 有权
    用于冷却电子元件的热连接器

    公开(公告)号：US06882533B2

    公开(公告)日：2005-04-19

    申请号：US10023227

    申请日：2001-12-14

    申请人： Cullen E. Bash ,  Chandrakant D. Patel ,  Glenn C. Simon

    发明人： Cullen E. Bash ,  Chandrakant D. Patel ,  Glenn C. Simon

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20636

    摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

    摘要翻译： 一种模块化半导体芯片冷却系统，其具有容易打开的外壳，其限定了配置成容纳承载待冷却部件的印刷电路板的室。 外壳可以包括储存器，冷凝器和泵。 室内的喷雾器可调节地安装在一个或多个支架上，以允许每个喷雾器为其各自部件的单独高度设定。 外壳可以通过快速释放连接容易地从计算机系统中移除。 计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统，从各个模块中去除冷凝功能。

    Computer system bulkhead plate for attenuating electromagnetic interference (EMI) at a telephone jack connector
    7.
    发明授权
    Computer system bulkhead plate for attenuating electromagnetic interference (EMI) at a telephone jack connector 失效
    用于衰减电话插孔连接器电磁干扰（EMI）的计算机系统隔板

    公开(公告)号：US06508653B2

    公开(公告)日：2003-01-21

    申请号：US09675369

    申请日：2000-09-29

    申请人： Christopher G. Malone ,  Glenn C. Simon

    发明人： Christopher G. Malone ,  Glenn C. Simon

    IPC分类号： H01R466

    CPC分类号： G06F1/182 ,  H01R13/6584 ,  H01R2201/06 ,  Y10S439/939

    摘要： A bulkhead plate member for providing an attenuating barrier for electromagnetic interference (EMI) noise in a computer system housing. The bulkhead plate member includes a rectangular shaped main portion having a material thickness. The main portion has a plurality of edge walls defining an opening for receiving a peripheral component connector affixed to a printed circuit board (PCB). The edge walls are adapted to contact side walls of the peripheral component connector to provide contact regions substantially perpendicular to the main portion and greater than the material thickness of the main portion, such that EMI noise is conducted through the bulkhead plate member, at the edge walls of the opening, to a bulkhead wall of the computer system housing thereby suppressing the EMI noise. The edge walls of the opening provides increased surface area contact between the bulkhead plate member and the peripheral component connector to maximize the attenuation of EMI noise around the connector.

    摘要翻译： 一种隔板板构件，用于在计算机系统壳体中提供用于电磁干扰（EMI）噪声的衰减屏障。 隔板板构件包括具有材料厚度的矩形主体部分。 主要部分具有限定用于接收固定到印刷电路板（PCB）的外围部件连接器的开口的多个边缘壁。 边缘壁适于接触外围部件连接器的侧壁，以提供基本上垂直于主要部分并且大于主要部分的材料厚度的接触区域，使得EMI噪声通过隔板板件在边缘处被传导 开口的壁，到计算机系统壳体的隔壁，从而抑制EMI噪声。 开口的边缘壁提供了隔板板构件和外围构件连接器之间的增加的表面积接触，以最大化连接器周围的EMI噪声的衰减。