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公开(公告)号：US20220404199A1
公开(公告)日：2022-12-22
申请号：US17777577
申请日：2020-11-19
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Keisuke KOYAMA , Kentaro AKIYAMA , Naoki SASOU , Masahiro TADA , Tomonori NISHIDA
Abstract: Provided is a resin panel enabling an infrared sensor to fully function when the resin panel is applied as a protective cover to the infrared sensor. The resin panel comprises at least a core layer and has a light transmittance at a wavelength of 905 nm of 85% or more and a visible light transmittance of 20% or less.
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