公开(公告)号：US20220297913A1

公开(公告)日：2022-09-22

申请号：US17637901

申请日：2020-08-27

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroyoshi NAKAJIMA ,  Katsuyuki MOTAI ,  Yuka TACHIKAWA ,  Makoto MIZOSHIRI ,  Kazushi SATO

IPC: B65D75/26 ,  B65D33/00 ,  B65D81/18 ,  B65D77/04

Abstract: A packaging material used for a bag for transporting of a silicon material is a laminate in which a first resin base, barrier, second resin base, resin, and sealant layers are laminated in that order. A resin layer indentation elastic modulus is smaller than an indentation elastic modulus of each of the first and second resin base layers by one or more orders of magnitude, a sealant layer indentation elastic modulus is smaller than a first resin base layer indentation elastic modulus of and a second resin base layer indentation elastic modulus by one or more orders of magnitude, and a difference between the first resin base layer indentation elastic modulus and the second resin base layer indentation elastic modulus is smaller than a difference between the second resin base layer indentation elastic modulus and the indentation elastic modulus of the resin layer.

公开(公告)号：US20190300253A1

公开(公告)日：2019-10-03

申请号：US16335827

申请日：2017-09-22

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Taku MUNEDA ,  Masahiro IMAI ,  Yuka TACHIKAWA

IPC: B65D65/40 ,  B32B7/02 ,  F25D23/06

Abstract: An outer packing material for vacuum insulation material by having a thermally weldable film and a gas barrier film in this order; wherein the product of the tensile elasticity of the outer packing material for vacuum insulation material and the cube of a thickness of the outer packing material for vacuum insulation material is 3.0 MPa·mm3 or less; and push-in elasticity of the thermally weldable film is 0.8 GPa or more.