Abstract:
An object of the present invention is to provide a curable epoxy resin composition, which is cured to provide a cured product having a high glass-transition temperature and particularly having excellent balance between heat resistance and transparency.The present invention relates to a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing agent (B), or a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing catalyst (C). wherein R1 to R22, which may be the same or different, each represent a hydrogen atom, a methyl group or an ethyl group; and m and n, which may be the same or different, each represent an integer of 1 to 4.
Abstract:
An object of the present invention is to provide an epoxy resin composition which has properties and viscosity to be easily controlled, can be cured at a low temperature in a short time, and can provide a cured product having excellent mechanical characteristics such as high tensile elongation at break, and high heat resistance, and a cured product of the epoxy resin composition (resin cured product).An epoxy resin composition of the present invention contains: an alicyclic epoxy compound (A); at least one compound (B) selected from the group consisting of a lactone adduct compound having a hydroxy group (B1) and a polycarbonate polyol (B2); and a phenol resin (C). Preferably, the epoxy resin composition of the present invention further contains a curing catalyst (D).
Abstract:
An object of the present invention is to provide a curable epoxy resin composition, which is cured to provide a cured product having a high glass-transition temperature and particularly having excellent balance between heat resistance and transparency.The present invention relates to a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing agent (B). The curable epoxy resin composition further preferably comprises a curing accelerator (C). wherein R1 to R22, which may be the same or different, each represent a hydrogen atom, a methyl group or an ethyl group.