公开(公告)号：US20020026855A1

公开(公告)日：2002-03-07

申请号：US09887087

申请日：2001-06-25

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

IPC: C22C029/00 ,  C22C009/00 ,  B22F001/00

CPC classification number: F16C33/14 ,  B22F1/0003 ,  B22F2998/00 ,  B22F2999/00 ,  F16C33/12 ,  F16C2204/12 ,  F16C2220/20 ,  F16C2220/60 ,  Y10T428/12063 ,  B22F7/04 ,  C22C1/0425 ,  C22C32/00

Abstract: A copper-based sliding material produced by sintering, comprising at least two phases of copper and/or copper alloys which phases have hardness levels different form each other, and hard particles with an average particle size of 0.1 to 10 nullm which are dispersed in at least one phase with the exception of a softest phase in an amount of 0.1 to 10 vol.% of the whole copper-based sliding material, said sliding material satisfying (H2/H1)null1.2 in which H1 is the Vickers hardness of the softest phase and in which H2 is the Vickers hardness of a phase hardest in hardness including said hard particles.

Abstract translation: 通过烧结制造的铜基滑动材料，其包含至少两相的铜和/或铜合金，其相硬度水平彼此不同，并且平均粒度为0.1〜10μm的硬质粒子分散在 至少一相，除了整体铜基滑动材料的0.1〜10体积％的最软相外，所述滑动材料满足（H2 / H1）> = 1.2，其中H1是维氏硬度 最软相，其中H 2是包括所述硬颗粒在内的硬度最硬的相的维氏硬度。