公开(公告)号：US10720289B1

公开(公告)日：2020-07-21

申请号：US16553145

申请日：2019-08-27

Applicant: DARFON ELECTRONICS CORP.

Inventor： Hsin-Cheng Ho ,  Heng-Yi Huang ,  Tsai-Yu Chen ,  Hung-Chuan Cheng ,  Yang-Cheng Wu

IPC: H01H13/83 ,  H01H13/88 ,  H01H3/12 ,  H01H13/7065

Abstract: A light emitting keyboard includes a bottom board, keyswitches, and a lighting board. The lighting board is disposed between the bottom board and the keyswitches or under the bottom board and includes a flexible substrate having a first hole, multiple-light emitting diodes corresponding to the keyswitches, first and second silver-paste circuit layers formed on upper and lower surfaces of the flexible substrate respectively, a via pillar formed in the first hole to be coupled to the first and second silver-paste circuit layers, a copper layer plated on the first and second silver-paste circuit layers, and a first protection layer coated on the copper layer and having second holes. Each multiple-light emitting diode is disposed on the copper layer plated on the first silver-paste circuit layer through the corresponding second hole to be coupled to the first silver-paste circuit layer.

公开(公告)号：US10895372B2

公开(公告)日：2021-01-19

申请号：US16263017

申请日：2019-01-31

Applicant: Darfon Electronics Corp.

Inventor： Heng-Yi Huang ,  Hsin-Cheng Ho ,  Tsai-Yu Chen ,  Hung-Chuan Cheng

IPC: H01H13/83 ,  F21V23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03

Abstract: A light source board includes a substrate; a metal reactive layer disposed on the substrate; a metal conductive layer disposed on the metal reactive layer; a metal alloy layer disposed on the metal conductive layer; and at least one light source disposed on the metal alloy layer. A material of the metal reactive layer is a Sn—Bi type alloy or a Sn—Ag—Cu type alloy, and arrangements of materials of the metal reactive layer and the metal conductive layer are respectively an arrangement of silver paste and copper, an arrangement of silver paste and nickel, an arrangement of silver paste and silver, an arrangement of copper paste and copper, an arrangement of copper paste and nickel, or an arrangement of copper paste and silver.

公开(公告)号：US10727009B2

公开(公告)日：2020-07-28

申请号：US16208657

申请日：2018-12-04

Applicant: Darfon Electronics Corp.

Inventor： Heng-Yi Huang ,  Hsin-Cheng Ho ,  Tsai-Yu Chen ,  Hung-Chuan Cheng

IPC: H01H13/83 ,  H01H3/12 ,  F21V8/00

Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.

公开(公告)号：US10692663B2

公开(公告)日：2020-06-23

申请号：US16208645

申请日：2018-12-04

Applicant: Darfon Electronics Corp.

Inventor： Heng-Yi Huang ,  Hsin-Cheng Ho ,  Tsai-Yu Chen ,  Hung-Chuan Cheng

IPC: H01H13/83 ,  H01H3/12 ,  F21V8/00

Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.