公开(公告)号：US20150185087A1

公开(公告)日：2015-07-02

申请号：US14578551

申请日：2014-12-22

Applicant: DENSO CORPORATION

Inventor： Junichi OGOSHI ,  Hiroyuki KAWATA ,  Toshio TSUTSUI ,  Shinsuke OTA

IPC: G01K7/22

CPC classification number: G01K7/22 ,  G01K1/16

Abstract: In an electronic device, a heat generation part pattern is connected to a heat generating element to heat from the heat generating element. A temperature detecting element is disposed adjacent to a first surface of a substrate. A direct under layer pattern is disposed on a second surface of the substrate opposite to the temperature detecting element in an area including a portion corresponding to the temperature detecting element. An interlayer connection pillar connects between the heat generation part pattern and the direct under layer pattern to conduct heat. The heat generated from the heat generating element is effectively conducted to the temperature detecting element through the heat generation part pattern, the interlayer connection pillar, and the direct under layer pattern, and thus the temperature detecting element accurately detects the temperature of the heat generating element.

Abstract translation: 在电子设备中，将发热部件图案连接到发热元件，以从发热元件加热。 温度检测元件邻近基板的第一表面设置。 在包括对应于温度检测元件的部分的区域中，在与温度检测元件相对的基板的第二表面上设置直接下层图案。 层间连接柱连接在发热部分图案和直接下层图案之间以传导热量。 由发热元件产生的热量通过发热部件图案，层间连接柱和直下层图案有效地传导到温度检测元件，因此温度检测元件精确地检测发热元件的温度 。