公开(公告)号：US20200028443A1

公开(公告)日：2020-01-23

申请号：US16515437

申请日：2019-07-18

Applicant: DENSO CORPORATION

Inventor： Tomoya MIURA ,  Kenichi OOHAMA ,  Shintaro KOGURE

IPC: H02M7/00 ,  H01L23/473 ,  H01L25/065

Abstract: In a power converter, an insulation member is interposed between a first overlap portion of the near DC busbar and a second overlap portion of the far DC busbar in a protrusion direction. The first overlap portion is located closer to the converter component in the protrusion direction than the second overlap portion is. A near DC terminal is arranged to be closer to the first and second overlap portions than a far DC terminal is in an arrangement direction perpendicular to both the stack and protrusion directions. The near and far DC busbars are joined to the respective near and far DC terminals. The far DC busbar is joined to the far DC terminals of the respective semiconductor modules while bypassing the near DC terminals of the respective semiconductor modules.

公开(公告)号：US20190123657A1

公开(公告)日：2019-04-25

申请号：US16090145

申请日：2017-03-10

Applicant: DENSO CORPORATION

Inventor： Tomoya MIURA ,  Yuu YAMAHIRA ,  Kazuma FUKUSHIMA

IPC: H02M7/00 ,  H02M1/088 ,  H02M7/5387 ,  H02P27/06

CPC classification number: H02M7/003 ,  H01L23/46 ,  H02M1/088 ,  H02M7/5387 ,  H02P27/06

Abstract: A plurality of semiconductor elements and a control circuit unit are provided. The plurality of semiconductor elements which are connected in parallel are configured to perform switching at the same time. The control circuit unit includes a drive circuit connected to the plurality of semiconductor elements which perform operation at the same time, control wirings and reference wirings. The control wirings connect control electrodes of the semiconductor elements to the drive circuit. The reference wirings connect reference electrodes of the semiconductor elements to the drive circuit. A parasitic inductance in the reference wiring is made smaller than a parasitic inductance in the control wiring.

公开(公告)号：US20200245496A1

公开(公告)日：2020-07-30

申请号：US16851234

申请日：2020-04-17

Applicant: DENSO CORPORATION

Inventor： Tomoya MIURA ,  Kenshiro HIDA ,  Hiroyoshi SAWADA

IPC: H05K7/20 ,  B60L53/22 ,  H02M7/00

Abstract: A power conversion device includes an electronic component, a cooler, a housing, protruding pipes, and annular seal members. Each of the seal members includes a seal body portion interposed between a corresponding one of the protruding pipes and the housing, and a flange portion extending outward from the seal body portion in a radial direction and contacting an outer surface of the housing from an axial direction. The housing includes a peripheral wall surface formed to surround the flange portion from an outer peripheral side, and an annular groove portion formed along an outer peripheral edge of the flange portion inside the peripheral wall surface. The peripheral wall surface is formed to extend outward, in the axial direction, from an axial contact surface of the housing contacted by the flange portion.