公开(公告)号：US20150029673A1

公开(公告)日：2015-01-29

申请号：US14336346

申请日：2014-07-21

Applicant: DENSO CORPORATION

Inventor： Yuta KADOIKE ,  Hideki KABUNE ,  Toshihisa YAMAMOTO

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  B62D5/0406 ,  H01L2224/40245 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/181 ,  H05K3/284 ,  H05K7/20454 ,  H01L2924/00012

Abstract: An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.

Abstract translation: 表面安装在基板上的电子元件具有从电子元件的背面朝着背电极的周边部分朝向散热器突出的支脚部。 因此，如果基板翘曲，则突出的腿部邻接散热片的热接收面，从而保持背面电极和散热器之间的绝缘间隙。 结果，防止短路。