公开(公告)号：US20210225550A1

公开(公告)日：2021-07-22

申请号：US17054387

申请日：2019-06-06

Applicant: DEXERIALS CORPORATION

Inventor： Kosuke ASABA ,  Ryota AIZAKI

IPC: H01B1/22 ,  H01R11/01 ,  H01B17/64 ,  H01B3/00

Abstract: A method for manufacturing a connection body, and a method for connecting a component, which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. The method includes a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first electrode and a second component having a second electrode; a temporary fixing step of pressing the first component or the second component to sandwich the filler-aligned layer; and a final compression boding step of further pressing the first component or the second component after the temporary fixing step to connect the first electrode and the second electrode.

公开(公告)号：US20210249793A1

公开(公告)日：2021-08-12

申请号：US17054414

申请日：2019-06-06

Applicant: DEXERIALS CORPORATION

Inventor： Ryota AIZAKI ,  Kosuke ASABA

IPC: H01R4/04 ,  H01L23/00 ,  H01R12/62

Abstract: A connection body, a method for manufacturing a connection body, and a connection method which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. In a connection body in which a first component having a first electrode and a second component having a second electrode are connected to each other via a filler-containing film having a filler-aligned layer in which independent fillers are aligned in a binder resin layer, the maximum effective connection portion area where the first electrode and the second electrode face each other is 4,000 μm2 or less and a ratio of the effective connection portion area to a particle area on the connection portion projection plane is 3 or more.