公开(公告)号：US20190319003A1

公开(公告)日：2019-10-17

申请号：US16343380

申请日：2017-10-18

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi MIYAKE ,  Reiji TSUKAO ,  Tatsurou FUKAYA

IPC: H01L23/00 ,  C09J7/30 ,  C09J9/02 ,  C09J5/00

Abstract: An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.