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公开(公告)号：US20240290613A1
公开(公告)日：2024-08-29
申请号：US18436272
申请日：2024-02-08
Applicant: DISCO CORPORATION
Inventor： Naoki KITA
IPC: H01L21/02
CPC classification number: H01L21/02354
Abstract: A wafer processing method includes a circular recess forming step of forming a circular recess in a center of a back surface of a wafer to thereby form an annular projection surrounding the circular recess, and a modified layer forming step of applying a laser beam of such a wavelength as to be transmitted through the wafer to the annular projection to thereby form a modified layer.
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