公开(公告)号：US11725399B1

公开(公告)日：2023-08-15

申请号：US17967341

申请日：2022-10-17

申请人： DMX Membranes Limited

发明人： Sundeepan Sennik

IPC分类号： E04F15/18 ,  F24D3/14

CPC分类号： E04F15/182 ,  E04F15/185 ,  F24D3/142 ,  F24D3/146

摘要： A flooring underlayment comprises a membrane that includes a body panel having a panel top surface and a panel underside surface spaced apart from the panel top surface by a panel thickness. The membrane further includes a plurality of dimples projecting downward from the panel underside surface, each dimple having a dimple upper end open to the panel top surface, a closed dimple lower end spaced apart from the dimple upper end by a dimple height, and a dimple sidewall extending between the dimple upper end and the dimple lower end, the dimple sidewall configured to inhibit collapse of the dimple height when a load is applied to the flooring underlayment during use. The membrane includes a plurality of grooves open to the panel top surface and formed within a groove body projecting downward from the panel underside surface, each groove shaped to receive an elongated heating element therein.