公开(公告)号：US20200218399A1

公开(公告)日：2020-07-09

申请号：US16731348

申请日：2019-12-31

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Chang Jun MAENG ,  Heon KIM ,  Hyun Min SHIN

IPC: G06F3/044 ,  G06F3/041 ,  G02F1/1335

Abstract: A touch sensor module includes a touch sensor layer including sensing electrodes and traces extending from the sensing electrodes, an optical layer on the touch sensor layer to cover the sensing electrodes, a circuit connection structure spaced apart from the optical layer and electrically connected to the traces on an end portion of the touch senor layer, and a colored resin pattern filling a gap between the optical layer and the circuit connection structure. An optical disturbance at the gap is prevented by the colored resin pattern.

公开(公告)号：US20210286466A1

公开(公告)日：2021-09-16

申请号：US17195886

申请日：2021-03-09

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Hyun Min SHIN ,  Heon KIM

IPC: G06F3/044 ,  G06F3/041

Abstract: A touch sensor stack structure according to an exemplary embodiment of the present invention includes a touch sensor structure including a bonding portion, a circuit connection structure bonded to the bonding portion of the touch sensor structure, and an optical film stacked on the touch sensor structure. The optical film includes a protrusion covering an end portion of the circuit connection structure and overlapping the bonding portion. Damages of electrodes included in the touch sensor structure can be prevented by the optical film.