专利检索 ap:("DONGWOO FINE-CHEM CO., LTD.") AND inv:"Jungu LEE" 第 1 页

1.

发明申请
CIRCUIT BOARD 有权

公开(公告)号：US20220210923A1

公开(公告)日：2022-06-30

申请号：US17554144

申请日：2021-12-17

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Ki Joon PARK , Sung Jin NOH , Jungu LEE

IPC分类号： H05K3/00 , H05K3/28

摘要： A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.