SEMICONDUCTOR DEVICES, CMOS IMAGE SENSORS, AND METHODS OF MANUFACTURING SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICES, CMOS IMAGE SENSORS, AND METHODS OF MANUFACTURING SAME 审中-公开
    半导体器件,CMOS图像传感器及其制造方法

    公开(公告)号:US20090315137A1

    公开(公告)日:2009-12-24

    申请号:US12547046

    申请日:2009-08-25

    IPC分类号: H01L31/02

    摘要: A semiconductor device includes: a trench device isolating region formed in a substrate to define a photodiode active region; a channel stop impurity region formed in the substrate contacting the device isolating region, wherein the channel stop impurity region surrounds a bottom and a sidewall of the device isolating region; and a photodiode formed within the photodiode active region.

    摘要翻译: 半导体器件包括:形成在衬底中以限定光电二极管有源区的沟槽器件隔离区; 形成在与所述器件隔离区接触的衬底中的沟道阻挡杂质区,其中所述沟道阻挡杂质区围绕所述器件隔离区的底部和侧壁; 以及形成在光电二极管活性区域内的光电二极管。