公开(公告)号：US20220372304A1

公开(公告)日：2022-11-24

申请号：US17621653

申请日：2020-06-26

Applicant: DOW SILICONES CORPORATION

Inventor： Mark D. FISHER ,  Jarred Q. CRAMTON ,  Brian J. SWANTON ,  Timothy MORLEY

IPC: C09D5/33 ,  C09D7/61 ,  C09D183/04 ,  C09D163/00 ,  C09D133/08 ,  C09D133/10 ,  C08K3/36

Abstract: A hydrosilylation curable silicone elastomeric coating composition, which generally has a low viscosity to be self-leveling and/or which is designed for coating transparent substrates (such as glass) is provided, as well as a coated article comprising a substrate coated with a silicone elastomeric coating and the preparation and use thereof. The composition comprises: (i) at least one polydiorganosiloxane polymer having a viscosity of from 0.10 to 1,000 Pa.s at 25° C. and having at least two alkenyl and/or alkynyl groups per molecule; (ii) reinforcing filler comprising an MQ resin and optionally silica; (iii) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (iv) a hydrosilylation catalyst; and (v) an adhesion promoter.

公开(公告)号：US20230073487A1

公开(公告)日：2023-03-09

申请号：US17796998

申请日：2021-02-03

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

Inventor： Andrew B. SHAH ,  Douglas A. BRUNE ,  Jody J. HENNING ,  Nicholas A. PAULIK ,  Mark F. SONNENSCHEIN ,  Jarred Q. CRAMTON ,  Mark FISHER ,  Greg BECKER ,  Chris WINDIATE ,  David SHAWL ,  David R. SCHLADER ,  Eric J. HUKKANEN

IPC: C08J9/14 ,  C08L83/04

Abstract: This disclosure relates to continuous methods of making foamed silicone elastomers. This disclosure also relates to compositions used for forming foamed silicone elastomers. The compositions comprise: (i) an organopolysiloxane having at least two silicon-bonded unsaturated groups per molecule; (ii) an organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; (iii) a hydrosilylation catalyst; and (iv) a physical blowing agent. Foamed silicone elastomers can be prepared from such compositions, using, for example, the methods disclosed herein.