公开(公告)号：US10665742B2

公开(公告)日：2020-05-26

申请号：US15323517

申请日：2015-07-01

Applicant: DSM IP Assets B.V.

Inventor： Franciscus Gerardus Henricus Van Duijnhoven ,  Guido Jozefina Wilhelmus Meijers

IPC: H01L31/049 ,  C08J5/18 ,  C08L51/06

Abstract: This invention relates to a solar-cell module backing layer obtained by co-extruding obtained by melt co-extruding (i) a first polymer composition comprising (a) a polyamide, (b) an elastomer and (c) an elastomer that contains groups that bond chemically and/or interact physically with the polyamide, and wherein the first polymer composition comprises from 10 to 90 wt. % of the polyamide (a) and from 10 to 90 wt. % of the elastomer (b) and (c) (of the total weight of polyamide (a) and elastomer (b) and (c) present in the first polymer composition) and (ii) a second polymer composition comprising from 50-98 wt. % of elastomer and from 0.15-5 wt. % of groups (based on the total weight of the second polymer composition) that bond chemically and/or interact physically with the solar cell and optionally with the first polymer composition.