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公开(公告)号：US10796985B2
公开(公告)日：2020-10-06
申请号：US15628794
申请日：2017-06-21
发明人： Holger Beer , Lars Paulsen
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.
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公开(公告)号：US10910296B2
公开(公告)日：2021-02-02
申请号：US16991198
申请日：2020-08-12
发明人： Holger Beer , Lars Paulsen
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.
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公开(公告)号：US20220071066A9
公开(公告)日：2022-03-03
申请号：US17226219
申请日：2021-04-09
发明人： Georg Wecker , Ole Mühlfeld , Lars Paulsen , Henning Ströbel-Maier , Holger Beer , Christopher Klaehr , Klaus Olesen
IPC分类号： H05K7/20
摘要： The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).
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公开(公告)号：US20210227726A1
公开(公告)日：2021-07-22
申请号：US17226219
申请日：2021-04-09
发明人： Georg Wecker , Ole Mühlfeld , Lars Paulsen , Henning Ströbel-Maier , Holger Beer , Christopher Klaehr , Klaus Olesen
IPC分类号： H05K7/20
摘要： The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).
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公开(公告)号：US20220013371A1
公开(公告)日：2022-01-13
申请号：US17291725
申请日：2019-10-24
摘要： A mold tool 1 is described for molding a semiconductor power module having an electrical contact pin 2 which includes an electrical contact portion 3 for contacting a substrate 4 with another electrical component. The pin 2 comprises a protruding portion 5 being a top-sided pin connector. The mold tool 1 includes a first 6 and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess 7 in the first die 6 which communicates with the cavity within the second die. The recess 7 is filled with a cushion-like soft material 8 into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion 3 of the pin 2 by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.
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公开(公告)号：US20180012828A1
公开(公告)日：2018-01-11
申请号：US15628794
申请日：2017-06-21
发明人： Holger Beer , Lars Paulsen
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.
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公开(公告)号：US10999955B2
公开(公告)日：2021-05-04
申请号：US16477321
申请日：2017-12-22
发明人： Georg Wecker , Ole Mühlfeld , Lars Paulsen , Henning Ströbel-Maier , Holger Beer , Christopher Klaehr , Klaus Olesen
IPC分类号： H05K7/20
摘要： The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).
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公开(公告)号：US20200373229A1
公开(公告)日：2020-11-26
申请号：US16991198
申请日：2020-08-12
发明人： Holger Beer , Lars Paulsen
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.
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