Force distributing spring element
    1.
    发明授权
    Force distributing spring element 失效
    力分布弹簧元件

    公开(公告)号:US07289335B2

    公开(公告)日:2007-10-30

    申请号:US10615011

    申请日:2003-07-08

    IPC分类号: G11C11/00

    CPC分类号: H05K7/1061

    摘要: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.

    摘要翻译: 力分配器构造成用于布置在印刷电路板和与印刷电路板间隔开的加强板之间。 力分配器构造成在印刷电路板,插入器和承载在印刷电路板的与加强板相对的一侧上的平台栅格阵列模块之间分布压缩力。 力分配器包括弹簧元件,弹簧元件包括第一部分和第二部分,第一部分从第二部分径向向外延伸。 弹簧元件构造成用于放置,使得第一部分固定到加强板上,并且第二部分被偏置在与印刷电路板无关的压力接触中。

    Force distributing spring element
    2.
    发明授权
    Force distributing spring element 有权
    力分布弹簧元件

    公开(公告)号:US07539027B2

    公开(公告)日:2009-05-26

    申请号:US11926761

    申请日:2007-10-29

    IPC分类号: H05K1/11 H05K1/14

    CPC分类号: H05K7/1061

    摘要: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.

    摘要翻译: 力分配器构造成用于布置在印刷电路板和与印刷电路板间隔开的加强板之间。 力分配器构造成在印刷电路板,插入器和承载在印刷电路板的与加强板相对的一侧上的平台栅格阵列模块之间分布压缩力。 力分配器包括弹簧元件,弹簧元件包括第一部分和第二部分,第一部分从第二部分径向向外延伸。 弹簧元件构造成用于放置,使得第一部分固定到加强板上,并且第二部分被偏置在与印刷电路板无关的压力接触中。