公开(公告)号：US06856357B1

公开(公告)日：2005-02-15

申请号：US09591886

申请日：2000-06-09

Applicant: David Hugh Stevenson

Inventor： David Hugh Stevenson

IPC: H04N5/225

CPC classification number: H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor device includes an image sensor chip and an image sensor array formed on a top surface of the image sensor chip. The image sensor chip is mounted on a substrate and encapsulated by a dam wall formed on the substrate surrounding the periphery of the image sensor chip and a transparent lid member affixed to the upper edges of the dam wall. A barrier is formed on the surface of the chip extending along at least a substantial part of at least one side of the sensor array between the sensor array and the dam wall. The barrier is preferably formed with a height of at least three microns and surrounds the sensor array. The barrier may be formed during fabrication of the sensor chip. Where the sensor chip is a color image sensor including a mosaic of color filter material overlying the image sensor array, the barrier may be formed from the color filter material with the formation of the mosaic. The barrier prevents resin bleeding from the dam wall onto the surface of the sensor array.

Abstract translation: 图像传感器装置包括图像传感器芯片和形成在图像传感器芯片的顶表面上的图像传感器阵列。 图像传感器芯片安装在基板上，并且由围绕图像传感器芯片的周边的基板上形成的阻挡壁封住，并且固定在坝壁的上边缘的透明盖构件。 在芯片的表面上形成有阻挡层，其沿传感器阵列的至少一侧的至少一部分的至少一部分在传感器阵列和坝壁之间延伸。 屏障优选地形成有至少三微米的高度并且围绕传感器阵列。 阻挡层可以在制造传感器芯片期间形成。 在传感器芯片是包括覆盖在图像传感器阵列上的彩色滤光片的马赛克的彩色图像传感器的情况下，可以通过形成马赛克的滤色器材料形成屏障。 屏障防止树脂从坝壁渗出到传感器阵列的表面上。