Method for forming ceramic containing composite structure
    1.
    发明授权
    Method for forming ceramic containing composite structure 有权
    用于形成含陶瓷复合结构的方法

    公开(公告)号:US08206792B2

    公开(公告)日:2012-06-26

    申请号:US12282832

    申请日:2006-03-20

    IPC分类号: C23C4/10 C23C4/04

    CPC分类号: C23C4/12 C23C4/04 C23C4/06

    摘要: A method for forming a ceramic containing composite structure is proposed comprising the steps of (a) feeding a ceramic component that sublimes and a metallic or semi-conductor material that does not sublime into a thermal spray apparatus, (b) spraying the ceramic component and the metallic or semi-conductor material onto a substrate, whereby the ceramic component and the metallic or semi-conductor material deposit on the surface of the substrate, and (c) keeping the metallic or semi-conductor material on the substrate surface plastic during spraying at least in the region where the metallic or semi-conductor material actually strikes the surface.

    摘要翻译: 提出一种形成含陶瓷复合结构体的方法,包括以下步骤:(a)将升华的陶瓷组分和不升华的金属或半导体材料送入热喷涂装置,(b)将陶瓷组分和 金属或半导体材料到基板上,由此陶瓷部件和金属或半导体材料沉积在基板的表面上,和(c)在喷涂期间将金属或半导体材料保持在基材表面上塑性 至少在金属或半导体材料实际撞击表面的区域中。

    Method for Forming Ceramic Containing Composite Structure
    3.
    发明申请
    Method for Forming Ceramic Containing Composite Structure 有权
    陶瓷复合结构形成方法

    公开(公告)号:US20090304943A1

    公开(公告)日:2009-12-10

    申请号:US12282832

    申请日:2006-03-20

    IPC分类号: C23C4/10 C23C4/04

    CPC分类号: C23C4/12 C23C4/04 C23C4/06

    摘要: A method for forming a ceramic containing composite structure is proposed comprising the steps of (a) feeding a ceramic component that sublimes and a metallic or semi-conductor material that does not sublime into a thermal spray apparatus, (b) spraying the ceramic component and the metallic or semi-conductor material onto a substrate, whereby the ceramic component and the metallic or semi-conductor material deposit on the surface of the substrate, and (c) keeping the metallic or semi-conductor material on the substrate surface plastic during spraying at least in the region where the metallic or semi-conductor material actually strikes the surface.

    摘要翻译: 提出一种形成含陶瓷复合结构体的方法,包括以下步骤:(a)将升华的陶瓷组分和不升华的金属或半导体材料送入热喷涂装置,(b)将陶瓷组分和 金属或半导体材料到基板上,由此陶瓷部件和金属或半导体材料沉积在基板的表面上,和(c)在喷涂期间将金属或半导体材料保持在基材表面上塑性 至少在金属或半导体材料实际撞击表面的区域中。