ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20240395451A1

    公开(公告)日:2024-11-28

    申请号:US18383416

    申请日:2023-10-24

    Abstract: An electronic component includes a casing and an electronic element. The casing includes a bottom plate, a backplate, a first protrusion and a second protrusion. The bottom plate has a first surface. The backplate is connected with the bottom plate and perpendicular to the bottom plate. The backplate has a third surface and a fourth surface. The third surface and the fourth surface are opposite to each other. The first protrusion and the second protrusion are extended from the third surface of the backplate toward a direction parallel to the bottom plate, respectively. The electronic element is disposed on the first surface of the bottom plate and adjacent to the third surface of the backplate. The bottom plate, the backplate, the first protrusion and the second protrusion are disposed around the electronic element.

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