公开(公告)号：US20230026658A1

公开(公告)日：2023-01-26

申请号：US17663827

申请日：2022-05-17

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chia-Yi LIN ,  Wei-Chih LIN ,  Ren-Chun CHANG ,  Yan-Hui JIAN ,  Hsuan-Ting LIU ,  Li-Hsiu CHEN ,  Wen-Yin TSAI

IPC: H05K7/20

Abstract: An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.

公开(公告)号：US20230027917A1

公开(公告)日：2023-01-26

申请号：US17804567

申请日：2022-05-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wei-Chih LIN ,  Ren-Chun CHANG ,  Yan-Hui JIAN ,  Chia-Hsing CHEN ,  Li-Hsiu CHEN ,  Wen-Yin TSAI

IPC: H05K7/20

Abstract: An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.

公开(公告)号：US20240251524A1

公开(公告)日：2024-07-25

申请号：US18511507

申请日：2023-11-16

Applicant: Delta Electronics, Inc.

Inventor： Hsuan-Ting LIU ,  Yan-Hui JIAN ,  Chia-Hsing CHEN ,  Chen-Hsiu LEE ,  Kuan-Lung WU

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

Abstract: An immersion cooling system is provided and includes a storage tank, an adapter frame, and an electronic device. The storage tank includes an accommodating tank and a sealing cover for sealing the opening of the accommodating tank. The adapter frame includes a first wire channel attached to the side of the adapter frame, and is disposed in the accommodating tank in a vertical direction. The electronic device includes at least one power wire, and is inserted into the adapter frame along the above direction. The side of the electronic device is attached to the side of the first wire channel. A second wire channel is formed between the bottoms of the electronic device and the adapter frame, and the first and second wire channels communicate with each other. The power wire is connected to the circuit of the external power apparatus along the first and second wire channels.

公开(公告)号：US20230022650A1

公开(公告)日：2023-01-26

申请号：US17805467

申请日：2022-06-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wei-Chih LIN ,  Ren-Chun CHANG ,  Yan-Hui JIAN ,  Wen-Yin TSAI ,  Li-Hsiu CHEN

IPC: H05K7/20

Abstract: An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

公开(公告)号：US20230040488A1

公开(公告)日：2023-02-09

申请号：US17657629

申请日：2022-04-01

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chia-Hsing CHEN ,  Chiu-Chin CHANG ,  Yan-Hui JIAN ,  Chih-Jui CHEN ,  Chen-Hsiu LEE ,  Hsuan-Ting LIU ,  Chin-Lung LIU ,  Kuan-Lung WU ,  Li-Hsiu CHEN ,  Wen-Yin TSAI

IPC: B65D45/02 ,  B65D43/16 ,  B65D81/18 ,  F25D31/00

Abstract: An airtight device includes a container and an airtight cover on the container, and the airtight cover includes a fixing bracket, a door, and a pressuring handle. The fixing bracket has a through hole and a guiding slot, and the through hole communicates with internal space of the container. The guiding slot has adjacent first and second top surfaces, and the second top surface is higher than the first top surface. The door selectively covers the through hole. The pressuring handle pivoted on the door has a first section, a second section, and a rotating axis between the first and second sections, and the first section rotates relative to the second section. The second section receives a force to drive the first section to move from below the second top surface to below the first top surface such that the rotating axis pressures the door.

公开(公告)号：US20230023554A1

公开(公告)日：2023-01-26

申请号：US17662080

申请日：2022-05-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Yan-Hui JIAN ,  Chiu-Chin CHANG ,  Wei-Chih LIN ,  Ren-Chun CHANG ,  Chih-Hung TSAI ,  Li-Hsiu CHEN ,  Wen-Yin TSAI

IPC: H05K7/20

Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.