公开(公告)号：US20230070726A1

公开(公告)日：2023-03-09

申请号：US17987963

申请日：2022-11-16

Applicant: Delta Electronics, Inc.

Inventor： Sheng-Nan TSAI ,  Ying-Chung CHUANG ,  Chia-Jung LIU ,  Yi-Wei CHEN ,  Han-Yu TAI ,  Shao-Hsiang LO

IPC: H05K7/20

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.

公开(公告)号：US20220087077A1

公开(公告)日：2022-03-17

申请号：US17220092

申请日：2021-04-01

Applicant: Delta Electronics, Inc.

Inventor： Sheng-Nan TSAI ,  Ying-Chung CHUANG ,  Chia-Jung LIU ,  Yi-Wei CHEN ,  Han-Yu TAI ,  Shao-Hsiang LO

IPC: H05K7/20 ,  H05K1/02

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.