公开(公告)号：US20190189534A1

公开(公告)日：2019-06-20

申请号：US16322570

申请日：2017-08-02

Applicant: Denka Company Limited

Inventor： Toshitaka YAMAGATA ,  Saori INOUE ,  Hideki HIROTSURU ,  Ryoh YOSHIMATU ,  Ryuji KOGA

IPC: H01L23/373

CPC classification number: H01L23/3733 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/473

Abstract: Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.