公开(公告)号：US5975998A

公开(公告)日：1999-11-02

申请号：US943091

申请日：1997-09-26

申请人： Dennis L. Olmstead

发明人： Dennis L. Olmstead

IPC分类号： B24B41/06 ,  H01L21/304 ,  B24B7/22

CPC分类号： B24B37/30 ,  B24B41/06

摘要： Wafer processing apparatus for batch processing of wafers comprises a turntable, having a polishing surface thereon, capable of rotation about a turntable rotation axis. A pressure plate is constructed for simultaneously holding multiple wafers with a polish face of the wafers facing the polishing surface of the turntable. A polisher head capable of applying a normal force to the pressure plate is provided to drive the pressure plate toward the turntable so that the polish face of the wafers engages the polishing surface of the turntable for polishing of the wafers. A force distributing member intermediate the polisher head and the pressure plate is constructed for uniformly distributing the force applied by the polisher head to the pressure plate.

摘要翻译： 用于批量处理晶片的晶片处理装置包括具有其上的抛光表面的转盘，其能够围绕转台旋转轴线旋转。 构造压板同时保持多个晶片，其中晶片的抛光面朝向转盘的抛光表面。 提供能够对压板施加法向力的抛光头，以将压板驱动到转台上，使得晶片的抛光面与转盘的抛光表面接合以抛光晶片。 在抛光头和压板之间的力分配构件被构造成将由抛光头施加的力均匀地分布到压板。

公开(公告)号：US5394655A

公开(公告)日：1995-03-07

申请号：US114532

申请日：1993-08-31

申请人： Franklin L. Allen ,  William L. Smith ,  Thomas G. Debner ,  Dennis L. Olmstead

发明人： Franklin L. Allen ,  William L. Smith ,  Thomas G. Debner ,  Dennis L. Olmstead

IPC分类号： B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B7/04

CPC分类号： B24B37/26

摘要： The invention is to a polishing pad 14 that has a polishing surface 19 in which portions 17 and 18 of the polishing surface 19 have been removed. The removed areas 17 and 18 are annular rings adjacent an outer 15 and inner 16 edges of the polishing pad 14. The non-polishing surfaces 18 and 19 taper 17a and 18a downward from the polishing surface 19.

摘要翻译： 本发明涉及一种具有抛光表面19的抛光垫14，其中抛光表面19的部分17和18已被去除。 去除区域17和18是与抛光垫14的外部15和内部16边缘相邻的环形环。非抛光表面18和19从研磨表面19向下锥形17a和18a。

公开(公告)号：US5193316A

公开(公告)日：1993-03-16

申请号：US784491

申请日：1991-10-29

申请人： Dennis L. Olmstead

发明人： Dennis L. Olmstead

IPC分类号： B24B1/00 ,  B24B37/30 ,  H01L21/304

CPC分类号： B24B37/30

摘要： A method and apparatus for polishing semiconductor wafers in which a force applied to the wafer is uniformly distributed across a surface of the wafer during polishing using a hydrostatic or compliant material situated between the wafer and a piston. In a preferred embodiment, the hydrostatic or compliant material is an elastic solid or fluid filled bag. One or more teflon disks or teflon coated surfaces may be included between the hydrostatic or compliant material and a second compliant layer to form a bearing to allow the wafer to rotate about its central axis during polishing.

摘要翻译： 一种用于抛光半导体晶片的方法和装置，其中施加到晶片的力在抛光期间使用位于晶片和活塞之间的静压或柔性材料均匀地分布在晶片的表面上。 在优选实施例中，静液压或顺应性材料是弹性固体或流体填充袋。 一个或多个聚四氟乙烯盘或聚四氟乙烯涂覆的表面可以包括在静水或柔顺材料和第二柔顺层之间以形成轴承，以允许晶片在抛光期间绕其中心轴线旋转。