公开(公告)号：US20130011802A1

公开(公告)日：2013-01-10

申请号：US13542499

申请日：2012-07-05

申请人： Dieter HOLZEM

发明人： Dieter HOLZEM

IPC分类号： F27D7/00 ,  B65B47/02

CPC分类号： B65B47/04 ,  B29C51/424 ,  B65B47/02 ,  B65B47/10

摘要： The invention relates generally to a method for contact-free heating a thermoformable film prior to deforming the thermoformable film. Heating is carried out by at least one heater having at least one porous surface which faces the film and through which air flows. An air film is formed between the porous surface and the thermoformable film due to the flow of air through the porous surface. The invention also relates to a heating unit for contact-free heating a thermoformable film as well as to a packaging machine that includes such a heating unit.

摘要翻译： 本发明一般涉及在可热成型膜变形之前对可热成型膜进行无接触加热的方法。 通过至少一个加热器进行加热，所述加热器具有面向薄膜的至少一个多孔表面，空气流过该加热器。 由于穿过多孔表面的空气流动，在多孔表面和可热成膜之间形成空气膜。 本发明还涉及一种用于对可热成型膜进行无接触加热的加热单元以及包括这种加热单元的包装机。