公开(公告)号：US06717431B2

公开(公告)日：2004-04-06

申请号：US10137142

申请日：2002-05-02

申请人： Dieter Rathei ,  Joerg Wohlfahrt ,  Luis G. Andrade ,  Robert Petter ,  Thomas S. Taylor ,  Babatunde Ashiru ,  Mark E. Luzar ,  Michael B. Sommer ,  Ulrich K. Zimmermann

发明人： Dieter Rathei ,  Joerg Wohlfahrt ,  Luis G. Andrade ,  Robert Petter ,  Thomas S. Taylor ,  Babatunde Ashiru ,  Mark E. Luzar ,  Michael B. Sommer ,  Ulrich K. Zimmermann

IPC分类号： G01R3126

CPC分类号： H01L22/20

摘要： A method of calculating yield loss of semiconductor wafers which are tested with a test sequence to derive a total fail region count for each of the wafers, the semiconductor wafers having multiple chips thereon. The method comprises calculating a fail region count for each of the tests in the test sequence, calculating the test sequence limited yield loss for each of the wafers, and apportioning the test sequence limited yield loss to selected ones of the test based upon the absolute or cumulative number of fails identified by the tests of the test sequence. In some embodiments, core parametric test data is correlated with the test sequence limited yield and analyzed to determine reparability.

摘要翻译： 一种计算半导体晶片的屈服损耗的方法，其通过测试序列测试以导出每个晶片的总失败区域计数，半导体晶片具有多个芯片。 该方法包括计算测试序列中的每个测试的失败区域计数，计算每个晶片的测试序列受限产量损失，以及基于绝对值或绝对值的测试序列限制产量损失分配给选定的测试 通过测试序列的测试识别的故障累积次数。 在一些实施例中，核心参数测试数据与测试序列限制产量相关，并进行分析以确定可修复性。