公开(公告)号：US20190118517A1

公开(公告)日：2019-04-25

申请号：US16205687

申请日：2018-11-30

Applicant: Dow Global Technologies LLC

Inventor： Jeffrey E. Bonekamp ,  Yushan Hu ,  Nichole E. Nickel ,  Lih-Long Chu ,  John a. Naumovitz ,  Mark G. Hofius

IPC: B32B27/32 ,  B32B27/08 ,  H01L31/048 ,  H01L31/049

CPC classification number: B32B27/32 ,  B32B27/08 ,  B32B27/327 ,  B32B2250/242 ,  B32B2307/704 ,  B32B2457/12 ,  C08L53/00 ,  H01L31/0481 ,  H01L31/049 ,  H01L31/18 ,  Y02E10/50

Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.