公开(公告)号：US20230279165A1

公开(公告)日：2023-09-07

申请号：US18013224

申请日：2021-06-23

申请人： Dow Global Technologies LLC ,  Dow Silicones Corporation

发明人： Jordan C. Reddel ,  Mark F. Sonnenschein ,  David S. Laitar ,  Andrew B. Shah ,  Bethany M. Neilson ,  Colin LiPi Shan ,  David D. Devore ,  Jozef J. I. Van Dun ,  Philip D. Hustad ,  Zhanjie Li ,  Zachary S. Kean ,  Ken Kawamoto

IPC分类号： C08F210/02

CPC分类号： C08F210/02 ,  C08F2420/02

摘要： A process to form a crosslinked composition comprising thermally treating a composition at a temperature ≥ 25° C., in the presence of moisture, and wherein the composition comprises the following components: a) an olefin/silane interpolymer, b) a cure catalyst selected from the following: i) a metal alkoxide, ii) a metal carboxylate, iii) a metal sulfonate, iv) an aryl sulfonic acid, v) a tris-aryl borane, vi) any combination of two or more from i)-v). Also, a composition comprising the following components a and b, as described above. A process to form an olefin/alkoxysilane interpolymer, and the corresponding composition, said process comprising thermally treating a composition comprising the following components: a) an olefin/silane interpolymer, b) an alcohol, and c) a Lewis acid.