公开(公告)号：US11786125B2

公开(公告)日：2023-10-17

申请号：US17123101

申请日：2020-12-15

申请人： DuPuy Synthes Products, Inc.

发明人： George Mikhail ,  Binh Vu ,  Jochen Walser ,  Dan Dlugos ,  Mark Fichman ,  Seulki Lee ,  Navid Shahriari ,  Erfan Sheikhi ,  Maria Op de Beeck

IPC分类号： A61B5/00 ,  A61B90/00 ,  A61B5/103 ,  A61B17/80

CPC分类号： A61B5/0031 ,  A61B5/1036 ,  A61B17/80 ,  A61B90/06 ,  A61B2090/064

摘要： An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.