公开(公告)号：US20240266803A1

公开(公告)日：2024-08-08

申请号：US18434708

申请日：2024-02-06

Applicant: DustPhotonics

Inventor： Yoel Chetrit ,  Israel Weiss

IPC: H01S5/14 ,  H01S5/40

CPC classification number: H01S5/141 ,  H01S5/4087

Abstract: A method for operating multiple chip regions. The method includes aligning the multiple chip regions using first wavelength band signals, and conveying transmission signals of a second wavelength band signals. The multiple chip regions may be without a second wavelength band transmitter and include a path for receiving the second wavelength band signals from another chip.

公开(公告)号：US20230187904A1

公开(公告)日：2023-06-15

申请号：US18165293

申请日：2023-02-06

Applicant: DustPhotonics

Inventor： Yoel Chetrit ,  Israel Weiss

IPC: H01S5/14 ,  H01S5/02251 ,  H01S5/0683

CPC classification number: H01S5/142 ,  H01S5/02251 ,  H01S5/0683

Abstract: A method for aligning chip regions.