Entangled-photon pair emitting device

    公开(公告)号:US11829050B2

    公开(公告)日:2023-11-28

    申请号:US17903806

    申请日:2022-09-06

    发明人: Young-Ho Ko Mireu Lee

    IPC分类号: G02F1/39 H10N30/30

    CPC分类号: G02F1/39 H10N30/30

    摘要: An entangled-photon pair emitting device according to an embodiment of the inventive concept includes a piezoelectric structure having a first surface and a second surface, which face each other, wherein the piezoelectric structure includes an opening passing through the piezoelectric structure from the first surface to the second surface, a stress transfer medium that fills the opening, a light source emitting part disposed on the stress transfer medium, an upper electrode disposed on the first surface of the piezoelectric structure, and a lower electrode disposed on the second surface of the piezoelectric structure. Here, the light source emitting part includes a semiconductor thin-film and a quantum dot in the semiconductor thin-film.

    ENTANGLED-PHOTON PAIR EMITTING DEVICE
    3.
    发明公开

    公开(公告)号:US20230161222A1

    公开(公告)日:2023-05-25

    申请号:US17903806

    申请日:2022-09-06

    发明人: Young-Ho Ko Mireu Lee

    IPC分类号: G02F1/39 H01L41/113

    CPC分类号: G02F1/39 H01L41/113

    摘要: An entangled-photon pair emitting device according to an embodiment of the inventive concept includes a piezoelectric structure having a first surface and a second surface, which face each other, wherein the piezoelectric structure includes an opening passing through the piezoelectric structure from the first surface to the second surface, a stress transfer medium that fills the opening, a light source emitting part disposed on the stress transfer medium, an upper electrode disposed on the first surface of the piezoelectric structure, and a lower electrode disposed on the second surface of the piezoelectric structure. Here, the light source emitting part includes a semiconductor thin-film and a quantum dot in the semiconductor thin-film.