公开(公告)号：US20200350506A1

公开(公告)日：2020-11-05

申请号：US16795703

申请日：2020-02-20

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Doo-Hee CHO ,  YOUNG-SAM PARK ,  Byoung Gon YU

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52

Abstract: Provided are a flexible electronic device including device units, a first etching preventing layer provided on the device units, a conductive line provided on the first etching preventing layer and electrically connected to the device units, a flexible substrate covering the conductive line on the first etching preventing layer and the conductive line, a trench separating the device units and exposing a portion of a bottom surface of the first etching preventing layer and a side surface of each of the device units, and a flexible protective layer conformally covering a bottom surface of each of the device units and an inside of the trench, wherein each of the device units includes a protective substrate, driving parts provided on the protective substrate, and a first encapsulation layer configured to cover the driving parts, and a manufacturing method thereof.