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公开(公告)号:US20240087777A1
公开(公告)日:2024-03-14
申请号:US18263653
申请日:2021-02-01
Inventor: Nobuhiro TSUJI , Manabu MURATA , Hisashi KAWAKAMI , Yasuto IMAI , Yoshiro KOJIMA , Takao FUKUNAGA
IPC: H01C7/02
Abstract: A thermistor layer of the present invention is configured to be disposed in an electrical current path. The thermistor layer comprises a thermosensitive particle, a plurality of electro-conductive particles covering a surface of the thermosensitive particle, and a binder adhering the electro-conductive particles, the electro-conductive particles form an electro-conductive network, at least the surface of the thermosensitive particle is made of a thermoplastic resin, the thermoplastic resin softens at a temperature lower than a temperature at which the binder softens, and the thermistor layer is provided to become highly resistive due to softening and deformation of the thermoplastic resin.