公开(公告)号：US20040105750A1

公开(公告)日：2004-06-03

申请号：US10719829

申请日：2003-11-20

申请人： ESEC TRADING SA, A Swiss Corporation

发明人： Daniel Bolliger ,  Dominik Hartmann ,  Felix Leu ,  Eugen Mannhart

IPC分类号： B65B021/02

CPC分类号： H01L21/67132 ,  H01L2221/68322

摘要： The picking of a semiconductor chip from a foil takes place by means of a chip gripper which bears on a bondhead and can be deflected in a predetermined direction and with the aid of a needle. An inductive sensor serves the precise measurement of the deflection of the chip gripper with reference to the bondhead. The pick process itself is characterised by the following steps: a) Lowering the chip gripper to a height z0, that is greater than an average height of the surface of the semiconductor chips so that the chip gripper does not yet touch the semiconductor chip, b) Raising the needle to a predetermined height z1, whereby the needle raises the semiconductor chip in order to bring the semiconductor chip into contact with the chip gripper and then to increase the height of the chip gripper, and c) Raising the chip gripper, whereby the semiconductor chip detaches itself from the needle.

摘要翻译： 从箔片中取出半导体芯片通过一个芯片夹持器进行，该夹持器承载在接合头上，并且可以在预定的方向上偏转并借助于针头。 电感式传感器用于精确测量芯片夹持器参考接合头的偏转。 拾取过程本身的特征在于以下步骤：a）将芯片夹持器降低到高于半导体芯片的表面的平均高度的高度z0，使得芯片夹持器尚未接触半导体芯片，b ）将针抬高到预定的高度z1，由此针引出半导体芯片以使半导体芯片与芯片夹持器接触，然后增加芯片夹持器的高度，并且c）提升芯片夹持器，由此 半导体芯片将其自身从针脱离。