公开(公告)号：US11232885B2

公开(公告)日：2022-01-25

申请号：US15963667

申请日：2018-04-26

Applicant: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.

Inventor： Kenji Fujimori ,  Makoto Oya

IPC: H01B5/02 ,  H01B7/02 ,  H01F5/06 ,  H01F27/28 ,  H01B3/30 ,  H02K3/34 ,  H01B13/06 ,  H02K3/30 ,  H01B13/10 ,  H01B13/14 ,  H01F27/32

Abstract: An insulated wire having at least one layer of coating of the wire, comprising a thermosetting resin layer, at the outer periphery of a conductor, wherein the thermosetting resin layer is comprised of thermosetting resin layers having a laminated structure formed by coating and baking a thermosetting resin varnish; and wherein, in said laminated structure, an innermost layer having contact with the conductor comprises a thermosetting resin having an imide bond and is a layer having an average thickness of more than 5 μm and 10 μm or less; a method of producing the insulated wire; a coil; a rotating electrical machine; and an electrical or electronic equipment.