公开(公告)号：US20230091503A1

公开(公告)日：2023-03-23

申请号：US17990038

申请日：2022-11-18

Applicant: East China University of Science and Technology

Inventor： Changsheng Liu ,  Hongyan He ,  Lili Jin ,  Dian Zhang

IPC: A61M37/00 ,  B29C33/38

Abstract: The present invention relates to a preparation method for a microneedle patch. Specifically, the present invention provides a preparation method for a microneedle patch, and the method comprises steps: (1) milling a base into a master mold of the microneedle patch; (2) conducting surface treatment on the master mold, to obtain the treated master mold; (3) conducting reverse molding on a surface of the treated master mold, conducting deaeration, curing, and demolding, to obtain the cured daughter mold; and (4) casting the modification solution on the surface of the daughter mold, and then conducting deaeration, drying and curing, to obtain the microneedle patch. The method for preparing the microneedle patch in the present invention can greatly reduce the milling difficulty, and save the milling cost and time. The microneedle molds with different aspect ratios, areas and shapes can also be prepared as required, following with reverse molding to diverse microneedle patches. Therefore, a feasible implementation scheme is provided in present invention for the production application of the microneedles and the feasibility of the wide application is greatly enhanced.