公开(公告)号：US12092305B2

公开(公告)日：2024-09-17

申请号：US17179606

申请日：2021-02-19

Applicant: Eaton Intelligent Power Limited

Inventor： Srinath K. Aanegola ,  Parameswari V. L. Gundavarapu ,  Andrew F. Scarlata ,  Chinmaya Rajiv Dandekar ,  Anand Kumar Ramachandran ,  Pushpak Paris Yabrer

IPC: F21V23/02 ,  F21S8/00 ,  F21S8/04 ,  F21V15/01 ,  F21V23/00 ,  F21V25/12

CPC classification number: F21V23/023 ,  F21S8/03 ,  F21S8/04 ,  F21V15/01 ,  F21V23/008 ,  F21V25/12

Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.

公开(公告)号：US20210262652A1

公开(公告)日：2021-08-26

申请号：US17179606

申请日：2021-02-19

Applicant: Eaton Intelligent Power Limited

Inventor： Srinath K. Aanegola ,  Parameswari V. L. Gundavarapu ,  Andrew F. Scarlata ,  Chinmaya Rajiv Dandekar ,  Anand Kumar Ramachandran ,  Pushpak Paris Yabrer

IPC: F21V31/00 ,  F21V15/01 ,  F21S8/04 ,  F21S8/00

Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.