公开(公告)号：US20230234107A1

公开(公告)日：2023-07-27

申请号：US18156399

申请日：2023-01-19

申请人： Ebara Corporation

发明人： NAOYUKI HANDA ,  Satomi Hamada ,  Tomoya Nishi

IPC分类号： B08B3/12 ,  B08B3/02 ,  B08B3/08 ,  B08B1/00 ,  B08B1/04 ,  B01F23/23 ,  B01F23/2373 ,  B01F23/237

CPC分类号： B08B3/12 ,  B08B3/02 ,  B08B3/08 ,  B08B1/001 ,  B08B1/04 ,  B01F23/238 ,  B01F23/2373 ,  B01F23/23764 ,  B01F23/23765 ,  B01F2101/58

摘要： A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.