公开(公告)号：US20140104793A1

公开(公告)日：2014-04-17

申请号：US13840299

申请日：2013-03-15

Applicant: Electronics and Telecommunication Research Institute

Inventor： Chan Woo PARK ,  Jae Bon KOO ,  Sang Chul LIM ,  Ji-Young OH ,  Soon-Won JUNG

IPC: H05K1/02 ,  H01L21/768

CPC classification number: H05K1/0283 ,  H01L21/76898 ,  H01L23/5387 ,  H01L29/78603 ,  H01L2924/0002 ,  H05K3/4644 ,  H05K2201/097 ,  H01L2924/00

Abstract: Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the first stretchable insulating layer, and forming a transistor on the coil interconnection.

Abstract translation: 提供一种可拉伸电子装置及其制造方法。 该制造方法包括在第一基板上形成线圈互连，形成覆盖线圈互连的第一可拉伸绝缘层，在第一可拉伸绝缘层上形成第二基板，将第一基板与卷绕互连和第一可拉伸绝缘层分离， 以及在线圈互连上形成晶体管。