公开(公告)号：US20190067235A1

公开(公告)日：2019-02-28

申请号：US16115060

申请日：2018-08-28

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang-Seong CHOI ,  Yong-Sung Eom ,  Keon-Soo Jang ,  Seok Hwan Moon ,  Hyun-Cheol Bae ,  leeseul Jeong ,  Wagno Alves Braganca Junior

IPC: H01L23/00 ,  B23K26/20

Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.