公开(公告)号：US07923423B2

公开(公告)日：2011-04-12

申请号：US11046262

申请日：2005-01-27

申请人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeff Barnes ,  Ewa Oldak

发明人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeff Barnes ,  Ewa Oldak

IPC分类号： C11D7/50

CPC分类号： C11D7/3218 ,  C11D7/261 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D7/3281 ,  C11D11/0047

摘要： Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

摘要翻译： 可用于半导体制造用于诸如半导体器件前体结构的晶片衬底的表面制备和/或清洁的组合物。 组合物可用于处理具有或将要进一步加工以包括铜金属化的晶片，例如在诸如表面处理，预镀清洗，后蚀刻清洁和后化学机械抛光 清洁半导体晶圆。 组合物包含（i）链烷醇胺，（ii）季铵氢氧化物和（iii）络合剂，并且是储存稳定的，以及在暴露于氧气时不变暗和降解。

公开(公告)号：US20060166847A1

公开(公告)日：2006-07-27

申请号：US11046262

申请日：2005-01-27

申请人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeff Barnes ,  Ewa Oldak

发明人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeff Barnes ,  Ewa Oldak

IPC分类号： C11D7/32

CPC分类号： C11D7/3218 ,  C11D7/261 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D7/3281 ,  C11D11/0047

摘要： Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

摘要翻译： 可用于半导体制造用于诸如半导体器件前体结构的晶片衬底的表面制备和/或清洁的组合物。 组合物可用于处理具有或将要进一步加工以包括铜金属化的晶片，例如在诸如表面处理，预镀清洗，后蚀刻清洁和后化学机械抛光 清洁半导体晶圆。 组合物包含（i）链烷醇胺，（ii）季铵氢氧化物和（iii）络合剂，并且是储存稳定的，以及在暴露于氧气时不变暗和降解。

公开(公告)号：US20100056409A1

公开(公告)日：2010-03-04

申请号：US11814714

申请日：2006-01-26

申请人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeffrey A. Barnes ,  Ewa Oldak ,  Darryl W. Peters ,  Kevin P. Yanders

发明人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeffrey A. Barnes ,  Ewa Oldak ,  Darryl W. Peters ,  Kevin P. Yanders

IPC分类号： C11D7/32

CPC分类号： H01L21/02071 ,  C11D7/06 ,  C11D7/26 ,  C11D7/264 ,  C11D7/265 ,  C11D7/32 ,  C11D7/3218 ,  C11D11/0047 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/02074

摘要： Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of microelectronic device wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

摘要翻译： 用于微电子器件制造用于诸如微电子器件前体结构的晶片衬底的表面制备和/或清洁的组合物。 组合物可用于处理具有或将要进一步加工以包括铜金属化的晶片，例如在诸如表面处理，预镀清洗，后蚀刻清洁和后化学机械抛光 清洁微电子器件晶圆。 组合物包含（i）链烷醇胺，（ii）季铵氢氧化物和（iii）络合剂，并且是储存稳定的，以及在暴露于氧气时不变暗和降解。

公开(公告)号：US07922823B2

公开(公告)日：2011-04-12

申请号：US11814714

申请日：2006-01-26

申请人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeffrey A. Barnes ,  Ewa Oldak ,  Darryl W. Peters ,  Kevin P. Yanders

发明人： Elizabeth Walker ,  Shahri Naghshineh ,  Jeffrey A. Barnes ,  Ewa Oldak ,  Darryl W. Peters ,  Kevin P. Yanders

IPC分类号： C11D7/32

CPC分类号： H01L21/02071 ,  C11D7/06 ,  C11D7/26 ,  C11D7/264 ,  C11D7/265 ,  C11D7/32 ,  C11D7/3218 ,  C11D11/0047 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/02074

摘要： Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of microelectronic device wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

摘要翻译： 用于微电子器件制造用于诸如微电子器件前体结构的晶片衬底的表面制备和/或清洁的组合物。 组合物可用于处理具有或将要进一步加工以包括铜金属化的晶片，例如在诸如表面处理，预镀清洗，后蚀刻清洁和后化学机械抛光 清洁微电子器件晶圆。 组合物包含（i）链烷醇胺，（ii）季铵氢氧化物和（iii）络合剂，并且是储存稳定的，以及在暴露于氧气时不变暗和降解。