公开(公告)号：US06225601B1

公开(公告)日：2001-05-01

申请号：US09115112

申请日：1998-07-13

申请人： Emanuel Beer ,  Duoyan Shen ,  Eitan Zohar ,  Marc M. Kollrack

发明人： Emanuel Beer ,  Duoyan Shen ,  Eitan Zohar ,  Marc M. Kollrack

IPC分类号： F27B514

CPC分类号： H01L21/67109 ,  C03B29/02 ,  C23C16/46 ,  G05D23/1904 ,  G05D23/1932

摘要： A technique for heating a substrate support, such as a susceptor, includes establishing respective final temperature setpoints for first and second heating elements in the susceptor. The temperatures of the heating elements are raised to their respective final temperature setpoints based on a predetermined heating rate. The temperatures of the first and second heating elements are controlled so that the difference between the temperatures of the first and second heating elements does not exceed the predetermined value while the temperatures of the heating elements are raised to their respective final temperature setpoints. Controlling the temperatures includes setting interim setpoints for the first and second heating elements, where the interim setpoint for the heating element having the greater heating capacity depends on the current value of the interim setpoint of the other heating element and the predetermined value. The temperatures of the first and second heating elements are raised toward their respective interim temperature setpoints for a predetermined delay period. At the end of the delay period, new interim setpoints can be established and the process repeated until the temperature of at least one of the first and second heating elements is close to its respective final setpoint. A relatively high duty cycle can be achieved which also reduces the likelihood of deformation of the substrate support.

摘要翻译： 用于加热衬底支撑件（例如基座）的技术包括为基座中的第一和第二加热元件建立相应的最终温度设定点。 基于预定的加热速率将加热元件的温度升高到它们各自的最终温度设定点。 控制第一和第二加热元件的温度，使得第一和第二加热元件的温度之间的差值不超过预定值，同时将加热元件的温度升高到其各自的最终温度设定点。 控制温度包括设置第一和第二加热元件的临时设定值，其中具有较大加热能力的加热元件的临时设定值取决于另一加热元件的临时设定值的当前值和预定值。 第一加热元件和第二加热元件的温度在其预定的延迟周期内朝其相应的临时温度设定点升高。 在延迟期结束时，可以建立新的临时设定点，并重复该过程，直到第一和第二加热元件中的至少一个的温度接近其相应的最终设定点。 可以实现相对高的占空比，这也降低了基板支撑件变形的可能性。