公开(公告)号：US20020139410A1

公开(公告)日：2002-10-03

申请号：US10039282

申请日：2002-01-02

申请人： Endevco Corporation

发明人： Leslie Bruce Wilner ,  Andrew J. Meyer ,  James Tjan-Meng Suminto ,  Joseph Salvatore Fragala

IPC分类号： H01L035/02 ,  H01L035/34

CPC分类号： G01K17/003 ,  G01J5/12 ,  H01L31/0203 ,  H01L31/09

摘要： A radiation sensor which includes a thermopile for detecting radiant energy. The thermopile and a support rim for the thermopile are fabricated as an integrated unit to form a support chip. The support chip is mated to a mating chip so that the thermopile is positioned in an inner cavity region of the radiation sensor. The sensor has a window which permits the transmission of radiant energy into the enclosure such that the radiant energy impinges upon a central absorber region of the thermopile.

摘要翻译： 辐射传感器，其包括用于检测辐射能的热电堆。 热电堆和用于热电堆的支撑边缘被制造为集成单元以形成支撑芯片。 支撑芯片配合到匹配芯片，使得热电堆位于辐射传感器的内腔区域中。 传感器具有允许将辐射能传递到外壳中的窗口，使得辐射能量撞击到热电堆的中心吸收体区域。