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公开(公告)号：US11870055B2
公开(公告)日：2024-01-09
申请号：US17161333
申请日：2021-01-28
申请人： Enevate Corporation
CPC分类号： H01M4/134 , H01M4/044 , H01M4/049 , H01M4/366 , H01M2004/027
摘要： The present application describes the use of a solid electrolyte interphase (SEI) fluorinating precursor and/or an SEI fluorinating compound to coat an electrode material and create an artificial SEI layer. These modifications may increase surface passivation of the electrodes, SEI robustness, and structural stability of the silicon-containing electrodes.
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公开(公告)号：US20210159485A1
公开(公告)日：2021-05-27
申请号：US17161333
申请日：2021-01-28
申请人： Enevate Corporation
摘要： The present application describes the use of a solid electrolyte interphase (SEI) fluorinating precursor and/or an SEI fluorinating compound to coat an electrode material and create an artificial SEI layer. These modifications may increase surface passivation of the electrodes, SEI robustness, and structural stability of the silicon-containing electrodes.
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公开(公告)号：US10916763B2
公开(公告)日：2021-02-09
申请号：US16430298
申请日：2019-06-03
申请人： Enevate Corporation
摘要： The present application describes the use of a solid electrolyte interphase (SEI) fluorinating precursor and/or an SEI fluorinating compound to coat an electrode material and create an artificial SEI layer. These modifications may increase surface passivation of the electrodes, SEI robustness, and structural stability of the silicon-containing electrodes.
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公开(公告)号：US20200381707A1
公开(公告)日：2020-12-03
申请号：US16430298
申请日：2019-06-03
申请人： Enevate Corporation
摘要： The present application describes the use of a solid electrolyte interphase (SEI) fluorinating precursor and/or an SEI fluorinating compound to coat an electrode material and create an artificial SEI layer. These modifications may increase surface passivation of the electrodes, SEI robustness, and structural stability of the silicon-containing electrodes.
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