公开(公告)号：US20060044678A1

公开(公告)日：2006-03-02

申请号：US10930377

申请日：2004-08-30

申请人： Eric Flint ,  Ning Shi ,  Qui-Fan Xiao

发明人： Eric Flint ,  Ning Shi ,  Qui-Fan Xiao

IPC分类号： G11B5/187

CPC分类号： G11B5/3163 ,  G11B5/3106

摘要： A method for applying a protective layer to an electronic device such as the ABS of a slider, magnetic head, etc. for reducing paramagnetic deadlayer thickness includes selecting an etching angle for minimizing formation of a paramagnetic deadlayer at an interface of an electronic device and an adhesive layer subsequently formed on the electronic device, etching a surface of an electronic device at the selected angle, the selected angle being less than about 75 degrees from an imaginary line extending perpendicular to the surface, forming an adhesive layer on the etched surface of the electronic device, and forming a protective layer on the adhesive layer. A magnetic head formed by the process is also disclosed.

摘要翻译： 将保护层施加到诸如滑块，磁头等的ABS的用于降低顺磁性层的厚度的电子设备的方法包括选择蚀刻角度以最小化在电子设备的界面处形成顺磁性残留层 随后形成在电子设备上的粘合剂层，以选定的角度蚀刻电子器件的表面，所选择的角度距离垂直于该表面延伸的假想线小于约75度，在该蚀刻表面上形成粘合剂层 电子器件，并在粘合剂层上形成保护层。 还公开了通过该方法形成的磁头。